1、Preparation and properties of stretchable low temperature resistant

Two innovative molecular design strategies for epoxy curing agents to address the inherent brittleness and cryogenic limitations of conventional epoxy systems are introduced.

2、Development of low temperature cure hybrid benzoxazine

New type of diallyl bisphenol-A (ABA) based benzoxazines and benzoxazine resins tailored with epoxy groups for low-temperature curing, have been developed using various curatives for high performance applications. The molecular structure of the synthesized compounds was analyzed using HRMS, 1 H NMR, 13 C NMR and ATR-FTIR analytical techniques.

3、Epoxy Curing Agents

Clear and pigmented coatings based upon Amicure® IC curing agents exhibit very rapid hardness development, excellent low temperature cure, very good color and UV stability and excellent surface appearance.

4、Thermal curing of epoxy resins at lower temperature using 4

In this study, we present N -methyl- N -pyridyl amide derivatives as thermal latent curing agents for use at lower temperatures, along with their mechanism of epoxy curing through the generation of the highly reactive 4- (methylamino)pyridine (4MAPy) (Figure 1).

5、Preparation and Properties of Epoxy Adhesives with Fast Curing at Room

Starting from the epoxy resin system, a fast-curing, low temperature-resistant epoxy resin was developed. Unlike adding accelerators to achieve rapid curing, modified adhesives avoid the pungent odor of accelerators and also have excellent mechanical properties.

Low viscosity and low temperature curing reactive POSS/epoxy hybrid

Results demonstrated that the OPEP system has excellent processability with low viscosity and long processing window period and satisfies the practical requirements of low-temperature curing.

Amine

Low temperature cure coatings allow applicators to extend the painting season into the fall and early winter months because coating application can continue even when the tem-perature falls below 50°F. This paper provides an overview of the curative tech-nologies for low temperature epoxy coatings.

Toughening and strengthening of low

Researchers have conducted a series of studies to address the application problem of epoxy resin and its composites in a low-temperature environment [12].

Preparation and properties of stretchable low temperature

A silane-modified curing agent (DETA-Si) and a flexible-chain-engineered curing agent (NBOn) were synthesized to achieve unprecedented mechanical–electrical–thermal synergies.

Ancamine® 2337M

Ancamine® 2337M is an amine-based curing agent tailored for low-temperature curing applications, like electronics that remain stable under ambient conditions, ensuring extended shelf life and ease of handling.

In modern industry and technology, the performance of materials directly impacts product quality and efficiency. Among these, epoxy resins, as high-performance composite matrices, are critical for applications in low-temperature environments. Low-temperature resistant epoxy curing agents are key to ensuring that epoxy resins maintain excellent properties under extreme cold conditions. This article explores the importance, classification, applications, and future trends of low-temperature resistant epoxy curing agents.

1. Importance of Low-Temperature Resistant Epoxy Curing Agents

Epoxy resins are widely used in fields such as electronic packaging, aerospace, and automotive manufacturing due to their outstanding physical and chemical properties. these applications often involve extreme temperature fluctuations, from hot summers to freezing winters, which significantly affect the performance of epoxy resins. In frigid regions, epoxy resins may lose adhesion or embrittle due to low temperatures, leading to structural failure. developing epoxy curing agents with superior low-temperature resistance is particularly critical.

2. Types and Applications of Low-Temperature Resistant Epoxy Curing Agents

Low-temperature resistant epoxy curing agents can be classified into two main categories: modified types and composite types.

1. Modified Low-Temperature Epoxy Curing Agents

These curing agents improve low-temperature performance by incorporating compounds with specific chemical structures, such as polyether polyols, silane coupling agents, and others. For example:

• Some modifiers increase hydrogen bond density in epoxy molecular chains, enhancing freeze-thaw cycle resistance.
• Others form hydrogen bonding bridges between adjacent molecules, strengthening the structural stability of the resin network.

2. Composite Low-Temperature Epoxy Curing Agents

Composite curing agents combine two or more curing agents to achieve synergistic low-temperature protection. A common example includes mixtures of epoxy resin, multifunctional organic anhydrides (e.g., maleic anhydride), and phenolic resins. Such combinations provide robust mechanical strength and adhesion at low temperatures.

3. Future Development Trends of Low-Temperature Resistant Epoxy Curing Agents

Advancements in technology and evolving social needs drive continuous innovation in this field. Key future trends include:

1. Green Initiatives

With growing environmental awareness, developing low-toxicity or non-toxic curing agents will become a priority. This aligns with stricter environmental regulations and reduces ecological impact.

2. High-Performance Materials

To meet industrial demands, future curing agents must offer higher mechanical strength, better adhesion, and lower brittleness temperatures. This will spur innovations in materials science and chemical engineering.

3. Smart Technologies

Artificial intelligence (AI) and machine learning can enable real-time monitoring and prediction of curing agent performance. This optimizes production processes, improves product quality, and lowers costs.

Low-temperature resistant epoxy curing agents play a vital role in maintaining epoxy resin performance under extreme cold. Through technological advancements and material innovation, future industrial applications will benefit from more efficient, environmentally friendly, and cost-effective solutions. As science progresses, research in this field will also expand into new areas, delivering greater value and societal progress.