1、Thermal curing of epoxy resins at lower temperature using 4

To expand the application fields of epoxy resins, there has been a growing demand for thermal latent curing agents that combine a lower curing temperature with a long storage lifetime for a one-component epoxy formulation.

2、Effect of curing pressure on the curing behavior of an epoxy system

Using a high-pressure differential calorimetry scanner (Netzsch DSC 204HP), the curing process of a bisphenol A diglycidyl ether system is studied in order to evaluate the influence of curing pressure.

3、Effect of Curing Agent and Temperature on the Rheological Behavior of

The effect of curing agent (6610) content and temperature on the rheological behavior of the epoxy resin CYD-128 was studied by DSC analysis and viscosity experiments.

4、Effect of Curing Agent Compounding on Heat Resistance of Epoxy Resin

Power insulation equipment needs to work in high temperature environment for a long time. With the increase of power level, higher requirements are put forward.

5、Preparation and Properties of Epoxy Adhesives with Fast Curing at Room

Starting from the epoxy resin system, a fast-curing, low temperature-resistant epoxy resin was developed. Unlike adding accelerators to achieve rapid curing, modified adhesives avoid the pungent odor of accelerators and also have excellent mechanical properties.

Heterogeneous dynamics in the curing process of epoxy resins

In this study, the microscopic dynamics in the curing process of a catalytic epoxy resin were investigated under different temperature conditions utilizing X-ray photon correlation...

Effect of Curing Agent Type on Curing Reaction Kinetics of Epoxy Resin

In this paper, low molecular weight polyamides, aromatic amines and anhydrides were selected as three kinds of curing agents and their isothermal viscosity-time properties were studied to...

The epoxy resin system: function and role of curing agents

The epoxy resin curing reaction is accelerated or regulated by epoxy curing agents. During the curing phase, the epoxy resin undergoes irreversible modifications.

A critical review of dynamic bonds containing curing agents for epoxy

Investigated the mechanical, thermomechanical, thermal, and recycling properties of the epoxy thermosets cured by developed curing agents. Addressed the challenges, opportunities and emerging trends in the field.

Epoxy Curing Agents – Latent Curing Agents for One Component Systems

In the next blog post, we’ll take a look at biobased curing agents for epoxy resin, which is becoming an ever-increasing need for formulators to achieve sustainability of their products.

In modern materials science, the combination of epoxy resin and curing agents forms the foundation for constructing various high-performance composite materials. Due to their excellent mechanical properties, electrical insulation, and chemical stability, these materials are widely used in aerospace, automotive manufacturing, electronics, and construction. When it comes to the preparation and application of these materials, temperature control is a critical step that directly impacts the performance and quality of the final product. This article explores the changes occurring during the heating process of epoxy resin and curing agents, as well as how these changes affect material properties.

Epoxy resin is a high-molecular-weight compound containing two or more epoxide groups, which form a three-dimensional network structure through polymerization reactions. A curing agent, meanwhile, is a substance that promotes the cross-linking reaction of epoxy resin, typically containing one or more compounds with reactive functional groups (such as hydroxyl, carboxyl, or amino groups). During heating, interactions between epoxy resin and the curing agent begin to occur, a process commonly referred to as "curing."

The curing process can be divided into several stages. Initially, epoxy resin and the curing agent are mixed at a lower temperature, often in a liquid or semi-solid state. As the temperature rises, reactive functional groups in the curing agent are gradually released and react with the epoxide groups in the epoxy resin. This reaction leads to cross-linking between epoxy molecules, forming a more robust network structure.

As the temperature increases further, the curing process reaches its peak. At this temperature, the reaction between epoxy resin and the curing agent becomes most intense, generating significant exothermic heat, which sharply raises the system’s temperature. This temperature point is critical for determining whether the material is fully cured and the extent of curing. Excessive temperatures may cause over-curing, degrading performance, while insufficient temperatures can result in incomplete curing, compromising the material’s effectiveness.

After reaching the peak temperature, the curing process gradually slows. As heat dissipates, the epoxy resin and curing agent cool down to room temperature. During this phase, the material’s properties also change. For example, cured epoxy resin becomes harder, more wear-resistant, and retains good flexibility and impact resistance. Additionally, cured epoxy resin exhibits higher thermal conductivity and electrical conductivity, making it valuable for electronic and electrical applications.

the heating process of epoxy resin and curing agents is not always smooth. In some cases, high temperatures may cause epoxy resin degradation or curing agent volatilization, harming material performance. strict temperature and time control are essential during the preparation and application of these materials. This requires precise experimental conditions and professional equipment to ensure optimal curing.

the changes in epoxy resin and curing agents during heating involve multifaceted chemical reactions, physical property shifts, and thermodynamic behaviors. Understanding these changes is crucial for optimizing material performance, improving production efficiency, and ensuring product quality. In future materials science research and industrial production, in-depth study and mastery of the heating characteristics of epoxy resin and curing agents will remain key priorities.