1、A critical review of dynamic bonds containing curing agents for epoxy

Investigated the mechanical, thermomechanical, thermal, and recycling properties of the epoxy thermosets cured by developed curing agents. Addressed the challenges, opportunities and emerging trends in the field.

2、Thermal curing of epoxy resins at lower temperature using 4

Abstract To expand the application fields of epoxy resins, there has been a growing demand for thermal latent curing agents that combine a lower curing temperature with a long storage lifetime for a one-component epoxy formulation.

3、Influence of different composite curing agents on the rapid curing

Liu et al.15 developed a low-temperature curing epoxy system by compounding three amine curing agents with different molecular structures and a medium-temperature curing agent (diaminodiphenylmethane) at appropriate ratios.

Epoxy

The curing agents sold under the Baxxodur® trademark, such as polyether amines, aliphatic and cycloaliphatic amines, differ in molecular structure, basicity and number of functional groups.

Epoxy Curing Agents

Clear and pigmented coatings based upon Amicure® IC curing agents exhibit very rapid hardness development, excellent low temperature cure, very good color and UV stability and excellent surface appearance.

High

Discover premium curing agents for epoxy resins offering superior chemical resistance, precise control, and enhanced mechanical properties. Ideal for industrial, construction, and specialty applications.

Effects of curing temperature on the structure and properties of epoxy

Herein, two typical amine-type curing agents, 4,4′-diamino diphenylmethane (DDM) with precuring temperature at around 150 °C and diethylenetriamine (DETA) at 80 °C were utilized to regulate and control the phase structures of EP-poly (ε -caprolactone) (PCL) blends.

Latent Curing Agent of Epoxy Resin Based on Bio

DCPD-ER/V-fa can cure at a high temperature, which is attributed to the reaction between phenolic hydroxyl groups produced by ring-opening reaction of the benzoxazine and epoxy groups.

Research progress of medium temperature latent curing agent

The application and modification progress of several kinds of medium temperature latent curing agents such as dicyandiamide,imidazole,acid anhydride and microcapsules in epoxy resin system were reviewed,and the future research directions of such curing systems were prospected.

NORTH AMERICA EPOXY CURING AGENTS

Olin offers a robust portfolio of epoxy products, including a diverse range of curing agent chemistries and individual grades, to help meet specific formulating and application requirements.

Epoxy curing agents are indispensable components in numerous industrial applications, including coatings, adhesives, and sealing materials. Among the various types of curing agents, medium-temperature baked epoxy curing agents occupy a critical position in industrial fields due to their unique advantages. This article aims to explore the working principles, performance characteristics, application ranges, and future development trends of medium-temperature baked epoxy curing agents.

I. Working Principle of Epoxy Curing Agents

Epoxy curing agents are chemical substances that react with epoxy resins to form a three-dimensional network structure. They typically consist of two main components: reactive groups (e.g., hydroxyl groups in phenolic resins) and curing accelerators (e.g., amine compounds). When these components are mixed, they undergo chemical bonding reactions, causing epoxy resin molecules to cross-link, thereby achieving the desired mechanical strength and thermal resistance.

II. Performance Characteristics

1. Fast Curing Speed: Medium-temperature baked epoxy curing agents can complete the curing process in a short time, which is significant for improving production efficiency.
2. High Adhesion: The cured epoxy layer exhibits excellent mechanical properties and adhesion, firmly bonding to various material surfaces.
3. Good Temperature Resistance: These curing agents maintain stable performance at higher temperatures, making them suitable for high-temperature environments.
4. Environmental Friendliness: Many medium-temperature baked epoxy curing agents are formulated with non-toxic or low-toxicity raw materials, posing no harm to the environment or human health.

III. Application Ranges

1. Construction Industry: Widely used in architectural coatings, waterproof materials, floor paints, and other construction scenarios.
2. Automotive Manufacturing: Applied to automotive parts such as vehicle bodies, engine covers, and chassis to enhance wear and corrosion resistance.
3. Electronics Industry: Utilized in PCB encapsulation, component bonding, and other applications to ensure product reliability and stability.
4. Aerospace: Employed in critical aerospace equipment components (e.g., engine casings, structural parts) to guarantee long-term stable operation.

IV. Future Development Trends

With technological advancements and growing industrial demands, medium-temperature baked epoxy curing agents are continuously evolving. Future trends may include:

1. Green Environmental Protection: Developing more eco-friendly curing agents to reduce environmental pollution.
2. High Performance: Improving formulations and production processes to enhance curing agent performance for demanding applications.
3. Multifunctionalization: Creating composite curing agents that not only cure epoxy resins but also provide additional functions (e.g., moisture resistance, antifungal properties).
4. Intelligent Control: Leveraging modern sensor technology and automated systems to achieve smart and precise control over the curing process.

As a critical industrial chemical, medium-temperature baked epoxy curing agents play a vital role in improving production efficiency, ensuring product quality, and expanding application scopes. With ongoing technological progress, these curing agents will continue to evolve toward greater environmental friendliness, efficiency, and intelligence, contributing significantly to the development of diverse industries.