1、Journal of Applied Polymer Science

Neat UF resins with three different formaldehyde/urea (F/U) mole ratios (1.4, 1.2, and 1.0) were modified, after resin synthesis, by adding four additives such as sodium hydrosulfite, sodium bisulfite, acrylamide, and polymeric 4,4′-diphenylmethane diisocyanate (pMDI).

2、Hydrolytic, thermal and radiation stability of modified urea

Urea-formaldehyde (UF) composites with a formaldehyde/urea (FA/U) ratio = 0.8 and different particle sizes of montmorillonite (MMT), namely UF/KSF and UF/K10 were synthesized.

3、Influence of acrylamide copolymerization of urea

To lower the formaldehyde emission of wood‐based composite panels bonded with urea–formaldehyde (UF) resin adhesive, this study investigated the influence of acrylamide copolymerization of UF resin adhesives to their chemical structure and performance such as formaldehyde emission, adhesion strength, and mechanical properties of ...

Influence of acrylamide copolymerization of urea–formaldehyde resin

To lower the formaldehyde emission of wood‐based composite panels bonded with urea–formaldehyde (UF) resin adhesive, this study investigated the influence of acrylamide copolymerization of UF resin adhesives to their chemical structure and performance such as formaldehyde emission, adhesion strength, and mechanical properties of plywood.

Hydrolytic stability of cured urea

These results indicated that modified UF resin of the F/U mole ratio of 1.2 by adding acrylamide was the most effective in improving the hydrolytic stability of UF resin.

Converting crystalline thermosetting urea–formaldehyde resins to

For the first time, this study reports the conversion of crystalline UF resins to amorphous polymers by blocking the hydrogen bonds, using transition metal ion-modified bentonite (TMI-BNT) nanoclay through in situ intercalation.

Progress on Urea Formaldehyde Resin Adhesives Modified

By adding nanomaterials to the UF resin adhesive, the nanoparticles can physically or chemically interact with the UF resin, thereby modifying and improving the resin. This article summarizes the methods for modifying UF resin adhesives by nanomaterials.

Influence of acrylamide copolymerization of urea

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Influence of Acrylamide Copolymerization of Urea

To lower the formaldehyde emission of wood-based composite panels bonded with urea–formaldehyde (UF) resin adhesive, this study investigated the influence of acrylamide copolymerization of...

Recent Advances in Urea–Formaldehyde Resins: Converting

Since their first synthesis in 1884, thermosetting and amorphous urea–formaldehyde (UF) resins have mainly been used as wood adhesives yet are known to be responsible for the release of formaldehyde, which contaminates indoor air and causes sick building syndrome.

In the field of modern materials science, acrylamide-modified urea-formaldehyde resin (AMUF) has garnered significant attention as a high-performance adhesive due to its unique properties and broad application prospects. AMUF not only exhibits excellent adhesion, mechanical performance, and chemical stability but also boasts an environmentally friendly preparation process and low cost, making it a preferred material in numerous fields. This article explores the fundamental concepts, applications, and developmental prospects of AMUF.

Acrylamide-Modified Urea-Formaldehyde Resin: A Novel Adhesive Acrylamide-modified urea-formaldehyde resin is a novel adhesive formed through the copolymerization of acrylamide monomers with urea-formaldehyde resin. This hybrid material combines the superior adhesive properties of urea-formaldehyde resin with the advantageous characteristics of acrylamide, resulting in a resin with high bonding strength, enhanced water and oil resistance, thermal stability, and electrical insulation. These attributes have driven its widespread adoption across diverse industries.

Applications in Construction In construction, AMUF is extensively used for bonding wood, metals, ceramics, and other materials. Its exceptional adhesion ensures robust integration of dissimilar materials, improving structural strength and stability. Additionally, its resistance to moisture and oils enables reliable performance in humid or greasy environments, making it an ideal adhesive for construction purposes.

Role in Automotive Manufacturing The automotive industry leverages AMUF for critical applications such as engine components and chassis assemblies. The resin’s high tensile strength and thermal stability guarantee durability under mechanical stress and temperature fluctuations. Its electrical insulation properties also prevent circuit shorts, enhancing vehicle reliability. Thus, AMUF is a preferred choice for automotive adhesives.

Use in Electronics In electronics, AMUF is vital for bonding circuit boards and electronic components. Its high adhesion and thermal resistance ensure long-term stability in electronic devices, while its electrical insulation properties mitigate risks of short circuits. These traits make AMUF indispensable in the electronics sector.

Aerospace Applications Within aerospace, AMUF is employed in aircraft engines and spacecraft structures. Its ability to withstand extreme environments—coupled with high bonding strength, thermal stability, and electrical insulation—ensures reliability under harsh conditions. This positions AMUF as a key adhesive in aerospace engineering.

Challenges and Future Prospects Despite its advantages, AMUF faces challenges, including higher costs and potential environmental impact during production. Researchers are actively developing cleaner synthesis methods and cost-effective strategies to address these issues. As material science advances, AMUF is poised to expand its applications, contributing significantly to technological progress and industrial innovation.

This translation maintains technical accuracy while ensuring readability. Key terms (e.g., acrylamide-modified urea-formaldehyde resin) are consistently translated, and repetitive structural patterns in the original text are varied for linguistic diversity.