1、Simultaneous improvement of mechanical, adhesive and ablative
A phenolic epoxy-modified liquid silicone rubber was constructed by introducing a phenolic epoxy resin functionalized with double bonds. Compared with pure PDMS, the thermal stability of KFAP@PDMS was maintained well, and its tensile strength was increased by 170 %, elongation at break by 141 %, and adhesive strength by 209 %, respectively.
2、Multisource Lignin from Acidified Tetrahydrofurfuryl Alcohol Extraction
The performance analysis (bonding strength, free formaldehyde, and viscosity) revealed that phenolic resins prepared from phenylated lignin exhibited significantly enhanced bonding strength. Both pine and corn stover lignin proved suitable for phenolic resin preparation, providing a theoretical basis for subsequent research.
3、单宁改性酚醛树脂胶粘剂研究进展
收起 On the basis of introduction of tannin with renewable and environment- friendly biomass rawmaterial,the research progress of some condensed tannin-biomass raw materials（such as Acacia mearnsii,Larixgemlini and Acacia mangium） in modified PF（phenolic resin） adhesives was...
4、Modification of phenolic resin and its effect on adhesive properties of
To solve the problem of poor bonding effect of polyurethane (PU)/metal at room temperature when Chemlok218 was used as adhesive, a highly active PU modifier was used to modify phenolic resin (PF) in Chemlok218 to form a PF@NCO transition layer between Chemlok218 coating and PU. FTIR and TG analysis showed that the NCO group in PU modifier reacted with the hydroxyl group of PF to form carbamate ...
5、A comprehensive review on modified phenolic resin
Phenolic resin (PR), renowned for its strong adhesive properties, superior heat resistance, and excellent chemical stability, finds extensive applications in industries, such as electronics, coatings, and textiles. However, with the advancement of technology, the need to modify PR to meet higher standards in specialized fields has become a significant research focus. Current research on PR ...
Modern Phenolic Adhesives for Aviation and Engineering. Part 2
Epoxy phenolic and cresol novolac resins are widely used as components of adhesives, sealants, coatings, binders, etc. Epoxy novolac resins were modified with butadiene rubbers in order to increase their chemical stability and impact resistance [12–14].
Preparation and application of lignin
Under these conditions, the solid content of the prepared adhesive is 52.33%, and the bonding strength reaches 2.21 MPa. Woodbased panels are bonded using kenaf lignin-modified phenolic resin, industrial lignin-modified phenolic resin, and unmodified phenolic resin adhesives, and the bonding strength of different panels is tested.
Ceramizable phenolic adhesive modified by different inorganic particles
In this work, two ceramizable phenolic adhesives were prepared using ZrSi2 particles or ZrSi 2 /B 4C mix particles as the inorganic fillers. The thermal stability, bonding strength, microstructure and phase composition of the adhesives were investigated by TGA, shear strength of Al2 O 3 joints, SEM, EDS, XRD and XPS. The results show that these two adhesives have different bonding performances ...
A Review on Lignin‐Based Phenolic Resin Adhesive
The latest life cycle assessment displayed that partially replacing phenol with biobased lignin in the process of synthesizing phenolic resin adhesives used in wood panels industry can remarkably reduce carbon emissions and negative environmental impact.
Study on heat resistance of epoxy adhesive modified by
A high temperature resistant epoxy adhesive was developed by using bisphenol A epoxy resin(E-51) as resin matrix,bisphenol A type phenolic epoxy resin as modifier and 4,4-diaminodiphenyl sulfone (DDS) as curing agent.The results showed that the addition of phenolic epoxy resin greatly improved the temperature resistance of epoxy adhesive.The results of dynamic thermomechanical analysis ...
In modern industries and construction, adhesives play a critical role as the bonding agent between diverse materials. Their performance directly impacts the quality and lifespan of products. Phenolic resin modified adhesives, known for their exceptional bonding capabilities, heat resistance, and corrosion resistance, have gained widespread popularity. This article explores the characteristics and applications of these high-performance adhesives.
Phenolic Resin Modified Adhesives are formulated using phenolic resin as the base, combined with functional fillers, plasticizers, curing agents, and other additives through specialized processing. While retaining the inherent thermal stability, chemical resistance, and electrical insulation properties of phenolic resin, modifications enhance their adhesion strength, aging resistance, and compatibility with various materials.
Key Characteristics of Phenolic Resin Modified Adhesives
- Excellent Adhesive Performance: These adhesives cure rapidly at room temperature and exhibit high bonding strength. They withstand significant shear and tensile forces, suitable for bonding metals, plastics, ceramics, glass, and more.
- High Heat Resistance: Capable of maintaining adhesion at elevated temperatures, making them ideal for applications like electronic component encapsulation and aerospace composite bonding.
- Superior Chemical Resistance: Resistant to most chemicals, protecting bonded materials from corrosion and extending their lifespan.
- Electrical Insulation: Widely used in the electronics industry for insulating circuit boards and components.
- Environmental Friendliness: Formulated with low-toxicity or non-toxic materials, meeting eco-friendly standards.
Applications of Phenolic Resin Modified Adhesives
- Electronics Industry: Used for bonding circuit boards, encapsulating LEDs, and securing electronic components due to their electrical insulation properties.
- Aerospace Sector: Employed in aircraft structural parts (e.g., fuselages, wings) and spacecraft exteriors, leveraging their heat and corrosion resistance.
- Automotive, Construction, and Medical Devices: Enhance product safety and durability by bonding dissimilar materials effectively.
Limitations and Future Outlook
Despite their advantages, phenolic resin modified adhesives have limitations, such as higher costs and stringent operational requirements. their growing importance in modern industries—coupled with technological advancements—positions them for expanded applications in fields like advanced manufacturing and sustainable materials.
phenolic resin modified adhesives continue to drive innovation across industries, offering unparalleled performance in bonding, heat resistance, and durability. As demands evolve, their potential applications are poised to expand further.
