1、Amide functionalized ionic liquids as curing agents for epoxy resin

Stress-strain curves of DDS/TDE-85 and ILs/TDE-85 thermosets. (a) DDS/TDE-85; (b) 4/TDE-85;

2、联苯型环氧树脂强韧化TDE

A high performance epoxy resin (TDE-85) was modified by biphenyl epoxy resin 3,3′,5,5′ -tetramethylbiphenyl bisphenol diglycidyl ether (TMBP) with 3,3′ -diaminodiphenyl sulfone (3,3′-DDS) as curing agent by melt blending method. The mechanical properties of the modified resin system were studied.

3、Chemorheological behaviors of TDE

In this study, 1,4-cyclohexanedimethanol diglycidyl ether (EP-1) has been synthesized via a two-step process to toughen and lower the viscosity of TDE-85 epoxy first time and suitable for the resin transfer molding (RTM) process.

4、聚氨酯改性TDE

摘要 以混合芳胺为固化剂,通过聚氨酯 (PU)对4,5-环氧环己烷-1,2-二甲酸二缩水甘油酯 (TDE-85)与二酚基丙烷缩水甘油醚 (E-51)环氧树脂的混合树脂体系的改性,制备了高性能聚氨酯改性环氧树脂 (PU/EP)。

5、Curing behavior of pure epoxy (TDE

Download scientific diagram | Curing behavior of pure epoxy (TDE-85) and epoxy/5 wt% PIL composites with the speed of 5 °C min⁻¹.

TDE

简介 TDE-85 为三官能脂环族环氧树脂。 分子结构中同时含有脂环族环氧基和缩水甘油酯基,兼有脂环族环氧和缩水甘油酯的双重特性。 因存在高反应活性的缩水甘油酯基,故反应活性比一般的脂环族环氧树脂大, 环氧值较高, 粘度较低, 加工工艺性能好。

聚氨酯改性TDE

采用该预聚体、扩链剂1,4-丁二醇、交联剂三羟甲基丙烷对TDE-85/甲基四氢邻苯二甲酸酐（MeTHPA)环氧树脂体系进行改性，通过示差扫描量热法与红外光谱法分析，探讨了聚氨酯 (PU)改性环氧树脂体系固化反应机理及固化反应动力学特征。

TDE

对于TDE-85环氧树脂,采用间苯二胺 (MPD)、间苯二甲胺 (A-50)、二氨基二苯基砜 (DDS)、二氨基二苯基甲烷 (DDM)作为固化剂,确定了体系的最佳配比,通过DTA 分析,确定了各体系的固化工艺,测定了各浇铸体的各项性能.结果表明,模量最高达5.30 GPa,耐温性150℃～200℃.

Amide

As to thermosets of TDE-85 cured by these curing agents, their tensile strength (95.1–111.7 MPa) and elongation at break (2.69 to 4.20%) are significantly improved compared with the traditional curing systems of DDS/TDE-85 (DDS, 4,4′-diamino diphenyl sulphone).

Amide

As to thermosets of TDE-85 cured by these curing agents, their tensile strength (95.1–111.7 MPa) and elongation at break (2.69 to 4.20%) are significantly improved compared with the traditional curing systems of DDS/TDE-85 (DDS, 4,4′-diamino diphenyl sulphone).

In modern industrial and construction sectors, epoxy resins are highly favored due to their exceptional physical and chemical properties. Epoxy resins boast excellent adhesive performance, high mechanical strength, superior electrical insulation, and outstanding corrosion resistance. These characteristics have led to their widespread use in fields such as electronic encapsulation, composite material manufacturing, coatings, and adhesives. TDE-85 epoxy, a member of the epoxy resin family, has garnered significant attention in the industry due to its superior performance and broad application potential. selecting the appropriate curing agent is critical to fully unlocking the potential of TDE-85 epoxy. This article explores compatible curing agents for TDE-85 epoxy and analyzes their synergistic effects.

1. Amine Curing Agents

Amine curing agents are among the most common curing agents for epoxy resins, including aliphatic amines, aromatic amines, and modified amines. These agents react chemically with TDE-85 epoxy to form stable cross-linked structures, significantly enhancing mechanical strength and heat resistance. For example, diethylene glycol bis(allyl carbonate) (DVP) and methylene diphenyl diisocyanate (MDI) are widely used aliphatic amine curing agents. They enable rapid curing at room temperature and deliver materials with good flexibility and fatigue resistance.

2. Anhydride Curing Agents

Anhydride curing agents are also ideal for TDE-85 epoxy. Typically bifunctional, they react with epoxy groups to form stable ester bonds, facilitating fast curing. Common anhydride curing agents like phthalic anhydride (PMA) and trimellitic anhydride (TMC) offer high curing temperatures, rapid curing speeds, and retain the material’s excellent mechanical and electrical insulation properties.

3. Imidazolidone Curing Agents

Imidazolidone curing agents are highly efficient promoters for epoxy resin curing. They accelerate the curing process by providing active hydrogen atoms or protons, reducing curing time and temperature. These agents exhibit excellent compatibility with TDE-85 epoxy and can be combined with various curing agents to achieve high-performance epoxy systems.

4. Phenolic Resin Curing Agents

Phenolic resin curing agents are traditional options for epoxy resins. They cure through condensation reactions with hydroxyl groups in the epoxy, making them suitable for TDE-85 epoxy and other epoxy types. Phenolic resins offer good thermal stability, chemical resistance, and high-temperature performance, along with robust mechanical and electrical properties.

5. Polyamide Curing Agents

Polyamide curing agents represent a new generation of epoxy curing agents. They cure via amidation reactions with carboxylic groups in epoxy resins. Their unique chemical structure provides exceptional mechanical strength, heat resistance, and chemical resistance. Additionally, polyamide curing agents can be mixed with various epoxy types to create high-performance systems.

TDE-85 epoxy pairs effectively with multiple curing agent categories, including amines, anhydrides, imidazolidines, phenolic resins, and polyamides. Each curing agent has distinct advantages and suitability depending on application requirements, cost considerations, and environmental impact. With advancements in materials and technology, future developments may introduce more efficient and eco-friendly epoxy curing agents, expanding possibilities for epoxy applications.