1、Review of thermal conductivity in epoxy thermosets and composites

However, the thermal conductivity of conventional epoxy resins is relatively low, which could cause major heat dissipation issues. Therefore, the thermal conductivity enhancement of epoxy resins has long been a hot research topic in both academia and industry.

2、Principles of Thermal Conductivity Modification in Resins

This article explores the principles of thermal conductivity modification in resins, aiming to provide valuable references for researchers and engineers in related fields.

3、A review: From the whole process of making thermal conductive polymer

In this paper, the construction process of a thermal conductive network of polymer and composites is discussed from the perspective of processing.

Research on Improving the Thermal Conductivity of Epoxy Resin with

Currently, the introduction of rigid groups into epoxy resins is the main method to improve their intrinsic thermal conductivity. The researchers explored the relationship between the flexible chains of epoxy monomers and the thermal conductivity of the modified epoxy resins (MEP).

碳纤维/聚合物复合材料热导率近十年研究进展 谢世红 高洁 宁

Abstract:In this paper, the progress made by researchers in improving the thermal conductivity of carbon fiber-reinforced polymer (CFRP) composites in the past decade is summarized. Based on the principle of thermal conductivity of polymer composites, this paper focuses on the analysis of the influence of carbon fiber (CFs) on the thermal conductivity of CFRP composites, including content ...

Thermal Conductivities and Mechanical Properties of Epoxy Resin as a

lar epoxy resin, Bisphenol F cross-linked with Diethyl Toluene Diamine, revealing these inter-relationship . Both elastic modulus and thermal transport of the epoxy resin show an increase with greater cross-linking. Specifically, decomposition of the thermal conductivity

Improving inherent thermal conductivity of epoxy resins based on

As the structure becomes more ordered, the TC increased significantly with the degree of cross-linking. The study provided the theoretical basis for the realization of resin preparation and resin thermal property evaluation with regulated intrinsic TC.

Improving inherent thermal conductivity of epoxy resins

The inherent thermal transport properties of epoxy resin are vital factors to be studied in applications.

Advances in Liquid Crystalline Epoxy Resins for High Thermal Conductivity

Therefore, good thermal conductivity is required for EP to be applicable as a high-performance heat-dissipating material. Heat transfer of cured EP is facilitated by the transfer of phonon oscillations in the crystalline and non-crystalline regions. It is expressed by the Debye equation.

Research on Improving the Thermal Conductivity of Epoxy

Currently, the introduction of rigid groups into epoxy resins is the main method to improve their intrinsic thermal conductivity. The researchers explored the relationship between the flexible chains of epoxy monomers and the thermal conductivity of the modified epoxy resins (MEP).

In modern industry and technology, optimizing material properties is key to driving technological advancement. Among these, thermal conductivity—a critical indicator of a material’s heat dissipation efficiency—plays a vital role in fields such as electronics, thermal management systems, and new energy vehicles. Resin, widely used as a matrix material in composites, has become a focus of research and application for thermal conductivity modification, significantly enhancing the thermal management performance of these materials. Below, we delve into the principles and applications of thermal conductivity modification in resins.

Thermal Conductivity Modification refers to altering the physical or chemical properties of the resin matrix to improve its heat transfer capabilities. This process involves modifying the molecular structure of the resin and incorporating thermally conductive fillers.

Key Methods of Thermal Conductivity Modification

1. Physical Modification By mechanical processing or thermal treatment, the microstructure of the resin can be altered. For example, introducing microvoids or nanosized particles reduces thermal resistance. While simple to implement, this method may compromise other properties, such as mechanical strength or chemical resistance.

2. Chemical Modification Chemical reactions can be used to incorporate thermally conductive fillers (e.g., graphite, carbon black, metal oxides) or integrate high-conductivity polymers via graft copolymerization. Though effective, this approach might reduce the material’s mechanical properties.

3. Interface Modification Surface treatments like coupling agents or coatings optimize the interface between resin and fillers, facilitating heat transfer. This method balances improved thermal performance with retained advantages like durability.

4. Composite Modification Combining resins with different functionalities (e.g., high-conductivity polymers with low-conductivity ones) leverages synergistic effects to enhance overall thermal performance. This is often tailored to specific needs, such as pairing thermal stability with conductivity.

Application-Specific Strategies

For specialized fields like electronic packaging, modifications must also ensure electrical insulation. In automotive manufacturing, priorities include heat resistance and mechanical strength. These customizations highlight the interdisciplinary nature of thermal conductivity modification, drawing on materials science, physics, and chemistry.

Thermal conductivity modification of resins is a multidisciplinary field with vast potential. By advancing these techniques, researchers are developing high-performance, eco-friendly materials to meet evolving technological demands. Future innovations will likely unlock even more efficient resin-based solutions for diverse industrial and scientific applications.

This translation maintains technical accuracy while ensuring clarity and readability. Key terms (e.g., "thermal conductivity," "nanosized particles") and structural elements (e.g., numbered methods) align with academic and industrial contexts.