1、Exploring synthesis techniques for an imidazole

In this study, an imidazole-based latent curing agent for one-component epoxy systems was developed, demonstrating excellent storage stability and low-temperature curing characteristics through dual protections of chemical capping and mechano-chemical capsuling.

2、Epoxy Curing Agents – Latent Curing Agents for One Component Systems

Latent curing agents are clearly the choice for one component heat activated epoxy systems. Latency is achieved through either physical insolubility or lack of chemical reactivity at room temperature, and the reactivity, solubility, and latency all must be carefully balanced.

3、Preparation of low‐temperature curing single‐component epoxy adhesives

This work selected epoxy resin (EPON‐828), pentaerythritol tetra (3‐mercaptopropionate) (PETMP), 1‐benzylimidazole (1‐BMZ), and stabilizer (salicylic acid) as materials to prepare low‐temperature curing single‐component epoxy adhesives.

4、Preparation of low

We believe our paradigm can provide a feasible approach for preparing low-temperature curing single-component epoxy adhesives, and has reference significance for the preparation of single-component adhesives in other systems, too.

Low

By adjusting reaction time, reaction temperature, and reactant ratios, yield was maximized, significantly reducing both reaction time and temperature. The three optimized curing agents were evaluated for their thermal and mechanical properties to assess curing behavior and storage stability.

Ancamine® 2337M

Ancamine® 2337M is an amine-based curing agent tailored for low-temperature curing applications, like electronics that remain stable under ambient conditions, ensuring extended shelf life and ease of handling.

Thermal curing of epoxy resins at lower temperature using 4

To expand the application fields of epoxy resins, there has been a growing demand for thermal latent curing agents that combine a lower curing temperature with a long storage lifetime for a one-component epoxy formulation.

Liquid phosphorus

Herein, two liquid phosphorus-containing bis-imidazole compounds, PPDM and DPCMI, were synthesized as latent curing agents for EP, demonstrating multiple effects in improving latency, thermal stability, mechanical properties, and fire safety.

Preparation of low‐temperature curing single‐component epoxy adhesives

The epoxy adhesives have been completely cured at 75°C for 5 h, and shear strength reached 10.20 ± 0.51 MPa, which was not significantly different from that of the system with uncoated...

Synthesis and properties of single

The results show that the one-component adhesive present excellent curing characteristics and latent properties. The E-51/PGMA microcapsule system can be cured at 100°C in 30min and its...

In modern industrial and construction fields, the performance and application range of materials are key determinants of their success. Among these, epoxy resin, as an important thermosetting plastic matrix material, is widely used in electronics, electrical engineering, automotive, aviation, construction, and other fields due to its excellent mechanical properties, electrical insulation, and chemical stability. The epoxy single-component low-temperature curing agent is one of the critical raw materials enabling the high-performance applications of these epoxy resin products.

The epoxy single-component low-temperature curing agent is specifically designed for epoxy resin systems used under low-temperature conditions. Its primary function is to promote the crosslinking reaction of epoxy resin at lower temperatures, thereby accelerating the curing process and enhancing the physical and chemical properties of the material. Compared to traditional two-component or multi-component epoxy systems, single-component systems offer advantages such as ease of operation, faster curing speed, and lower costs.

Composition and Characteristics The composition and properties of the epoxy single-component low-temperature curing agent determine its advantages for low-temperature applications. This curing agent typically consists of reactive diluents, hardeners, and fillers. Reactive diluents reduce the viscosity of the epoxy resin, allowing it to penetrate substrates more effectively. Hardeners chemically promote the crosslinking and curing of the epoxy resin, while fillers fill microscopic pores in the resin, improving density and mechanical strength.

Mechanism of Action in Low-Temperature Curing The role of the epoxy single-component low-temperature curing agent in the curing process is reflected in the following aspects:

1. Reduces Curing Temperature: Unlike traditional high-temperature curing methods, low-temperature curing agents enable curing at lower temperatures. This is critical for applications requiring energy savings or avoiding high-temperature impacts on material performance.

2. Accelerates Curing Speed: Low-temperature curing agents significantly shorten curing time, benefiting projects with tight production schedules. Rapid curing also reduces heat generation during the process, minimizing environmental temperature impacts on equipment.

3. Improves Mechanical Performance: Low-temperature curing not only speeds up the process but also enhances the mechanical properties of the final product. At low temperatures, molecular movement slows, increasing crosslinking density, resulting in a more durable material.

4. Enhances Electrical Performance: In electronic and electrical applications, low-temperature-cured epoxy resins often provide better electrical performance. This is due to reduced bubble and crack formation during curing, improving electrical insulation properties.

5. Lowers Costs: By reducing curing temperatures, low-temperature curing agents decrease energy consumption and related costs. Simplified curing processes also reduce reliance on specialized equipment and maintenance expenses.

Limitations and Challenges Despite its advantages, the epoxy single-component low-temperature curing agent has certain limitations. For example, it may not fully replace traditional high-temperature curing agents in extreme environments, as low-temperature curing might fail to meet material performance requirements. Additionally, selecting and using low-temperature curing agents requires compatibility with the epoxy system and alignment with the performance needs of the final product.

Optimizing Application To maximize the benefits of epoxy single-component low-temperature curing agents and overcome their limitations, manufacturers must research and adopt best practices. This includes selecting appropriate curing agent formulations, optimizing curing process parameters, and ensuring reliability and durability in specific applications.

the epoxy single-component low-temperature curing agent, as a vital component of epoxy resin systems, holds significant potential for low-temperature applications. With ongoing research and innovation, this material is expected to play an increasingly important role in future industrial and construction sectors.