1、Rigid and crosslinkable polyimide curing epoxy resin with enhanced
To increase comprehensive performance and enlarge the applicability of resin materials in thermodynamics, researchers have started to focus on the modification of epoxy resin. The mainstream method is to mix organic rubber elastomers into epoxy resin.
2、Polyimide
In this study, a series of polyimide-modified epoxy resin composite films (NPMFs) was developed and applied as protective coatings. The polyimide-modified epoxy resin was designed through cross-linking reactions between epoxy resin and polyimide, forming the film material.
3、Journal of Applied Polymer Science
This research is dedicated to improving the mechanical properties and thermal stability of epoxy resin modified with polyimide. Two types of imides, along with soluble polyimides incorporating trifluoromethyl and tert-butyl groups, were synthesized as modifiers for epoxy resins.
4、聚酰亚胺接枝氧化石墨烯改性环氧树脂的分子动力学模拟
首先，使用分子动力学（MD）模拟建立了聚酰亚胺（PI）和石墨烯片（GNS）以及聚酰亚胺（PI）接枝氧化石墨烯（GO）改性环氧树脂的物理共混模型，以及纯环氧树脂树脂，旨在深入研究这两种改性对环氧树脂的机械、热性能和粘合性能的影响。
Study on the Epoxy Resin Adhesive Modified by Polyimide
Abstract: Epoxy resin and Polyimide （PI） are two types of resins. It’s well known that epoxy adhesive is prominent in adhesive strength, which can be cured at low temperature and blended with other resin, but poorness in heat-resistant property.
Polyimide modified epoxy resin composite conductive adhesive and
For this reason, the present invention combines long side chain diamine, hydroxyl diamine with Alicyclic dianhydride polycondensation has obtained a new type of soluble active polyimide, because the polyimide has excellent solubility, so the polyimide can be dissolved in a high amount of epoxy resin conductive adhesive, used After modifying the ...
Novel epoxy resin adhesives toughened by functionalized poly (ether
The present study focuses on the development of a novel room temperature curable epoxy resin by blending with different proportions of hydroxyl terminated poly (etheretherketone)s (PEEKTOH) as thermoplastic toughening agent. The systems were cured using triethylenetetramine (TETA).
Soluble Polyimide‐Modified Epoxy Resin With Enhanced
This research is dedicated to improving the mechanical properties and thermal stability of epoxy resin modified with polyimide. Two types of imides, along with soluble polyimides incorporating trifluoromethyl and tert‐butyl groups, were synthesized as modifiers for epoxy resins.
Upcycling Waste Thermosetting Polyimide Resins into High‐Performance
Thermosetting polyimide (PI) has attracted extensive attention for its excellent properties, but the approaches to its end-of-life management are not sustainable, posing great threat to the ecosystem.
Preparation of polyimide modified epoxy resin adhesive for photoresist
In this paper, a modified epoxy resin system was prepared using bismaleimide (BMI) as the modifier, polyether amine (PEA) as the curing agent, and carboxyl-terminated liquid nitrile-butadiene rubber (CTBN) as the toughening agent.
Polyimide-Modified Epoxy Resin Adhesive
With the rapid development of modern industrial technology, innovations in materials science have brought unprecedented transformations to various industries. Among numerous materials, epoxy resin adhesives are highly favored due to their excellent mechanical properties, chemical stability, and adhesive capabilities. traditional epoxy resin adhesives often have limitations, such as long curing times and poor heat resistance. To overcome these deficiencies, scientists have turned their attention to polyimide-modified epoxy resin adhesives with superior performance. This article will explore in depth the preparation methods, application prospects, and challenges and opportunities of polyimide-modified epoxy resin adhesives.
1. Preparation Methods of Polyimide-Modified Epoxy Resin Adhesive
The preparation of polyimide-modified epoxy resin adhesive involves multiple steps, including raw material selection, ratio design, mixing and stirring, curing agent addition, and curing condition control. First, selecting appropriate polyimide monomers and epoxy resins as base materials is critical. Polyimide monomers exhibit excellent flexibility and fatigue resistance, significantly improving the toughness and impact resistance of epoxy resin adhesives; meanwhile, epoxy resins provide strong adhesion and mechanical strength. Next, a reasonable ratio design is essential to ensure good compatibility between polyimide and epoxy resin based on product performance requirements.
During the mixing and stirring stage, high-speed stirring or vacuum extraction methods are employed to ensure uniform dispersion of the two components. Additionally, adding an appropriate amount of catalyst can accelerate the polymerization reaction. The selection of curing agents is also crucial, typically choosing low-viscosity and highly active curing agents to facilitate subsequent curing processes. Finally, by adjusting parameters such as curing temperature, time, and pressure, effective control over the curing process of the epoxy resin adhesive is achieved.
2. Application Prospects of Polyimide-Modified Epoxy Resin Adhesive
Owing to its unique performance advantages, polyimide-modified epoxy resin adhesive shows broad application prospects in many fields. For example, in the electronic packaging sector, this adhesive can be used for circuit board bonding and chip fixation, providing excellent electrical and reliable performance. In the aerospace field, its exceptional high-temperature resistance and corrosion resistance make it suitable for manufacturing aircraft engine components and spacecraft structural parts. polyimide-modified epoxy resin adhesive is applicable in automotive manufacturing, medical devices, building reinforcement, and other industries, offering innovative solutions.
3. Challenges and Opportunities
Despite its advantages, polyimide-modified epoxy resin adhesive still faces challenges in practical applications. On one hand, the relatively high cost of raw materials limits its promotion in low-end markets; on the other hand, the production process is complex, requiring strict control of operational parameters at every step to ensure stable product quality. with technological advancements and changing market demands, new development opportunities have emerged.
On one hand, as the concept of green and environmentally friendly practices gains traction, low-VOC (volatile organic compound) adhesives are increasingly prioritized. developing polyimide-modified epoxy resin adhesives with low VOC emissions will become a future trend. On the other hand, advancements in smart manufacturing and automation technologies enable more precise process control, reducing production costs and improving efficiency.
As an emerging material, the preparation methods and application fields of polyimide-modified epoxy resin adhesive continue to evolve and improve. Despite certain challenges, its excellent performance and vast application potential position it to play a significant role in future technological innovation and industrial upgrading.
