1、High Thermal Stability and Low Dielectric Constant of BCB Modified

The resins showed low dielectric constant (k = 2.77 at 10 MHz) and thermal stability (T5% = 495.0 °C) after curing. Significant performance changes were observed with the increase in BCB structural units, and the functional silicone obtained does not require melting and dissolution during processing because of good fluidity at room temperature.

2、Preparation of modified epoxy resin with high hydrophobicity, low

The results showed that the modified epoxy resin had a high-water contact angle of 111.88°. However, its dielectric constant at 5 MHz was as high as 7.2. The increase in the water contact angle seriously damaged its dielectric properties.

3、Optimizing dielectric, mechanical, and thermal properties of epoxy

Fourier-transform infrared spectroscopy (FTIR), scanning electron microscopy (SEM), and energy-dispersive X-ray spectroscopy (EDX) are employed to reveal the chemical structure of the modified epoxy resin and the distribution of modifiers. Results confirm successful grafting and exceptional dispersion without agglomeration.

Machine Learning Model for Predicting Dielectric Constant of Epoxy

Researchers have repeatedly designed, synthesized, and measured materials to develop low DC materials by utilizing their knowledge, necessitating long development periods and high costs in terms of personnel, reagents, and equipment.

A mini‐review of ultra‐low dielectric constant intrinsic epoxy resins

The factors affecting the dielectric properties of epoxy-cured resins, and the common methods to decrease the ε value of epoxy-cured resins are reviewed in this article. Then, the design, synthesis and research progress of ultra-low ε epoxy resins are investigated with the relevant academic results.

High Thermal Stability and Low Dielectric Constant of BCB Modified

In this work, functional silicone resin with different BCB contents was prepared with two monomers. The resins showed low dielectric constant (k = 2.77 at 10 MHz) and thermal stability (T5% = 495.0 C) after curing.

High intrinsic thermal conductivity and low dielectric constant of

High integration, high frequency, high power, and miniaturization of electrical and electronic devices have raised higher demands for epoxy resins with both high intrinsic thermal conductivity and low dielectric properties.

Optimizing dielectric, mechanical, and thermal properties of epoxy

This study introduces three molecular modifications to epoxy resin systems using facile synthesis procedures, including modifiers with bulky groups and crosslinking potential to reduce the dielectric constant while enhancing mechanical and thermal reliability, along with deep traps to increase breakdown strength.

High

Cyanate ester resin (CE) is an ideal candidate for low dielectric constant (low- k) materials in the microelectronic industry, however the incoordination among mechanical, thermal and low- k properties greatly restricts their practical applications.

Toughness and Low Dielectric Cyanate Ester Resin Modified with

The bulky fluorene ring and its intrinsic low dipole moment make PES-b an effective modifier to reduce the dielectric constant (ε) and dielectric loss (tanδ), as well as to improve the toughness of BADCy resin composites.

In modern electronic technology, the dielectric constant, as a critical parameter for evaluating the insulating properties of materials, plays a vital role in ensuring the reliability and stability of electronic devices. Modified resins, due to their unique physical and chemical properties, are increasingly utilized in fields such as electronic components, energy storage, and composite materials. This paper discusses the concept, influencing factors, and practical significance of the dielectric constant of modified resins.

I. Basic Concept of the Dielectric Constant of Modified Resins

The dielectric constant is a physical quantity that describes how a material responds to an electric field, reflecting its ability to resist electrical polarization. For modified resins, the dielectric constant not only determines their insulating characteristics but also affects comprehensive properties such as mechanical performance and thermal stability. accurately measuring the dielectric constant of modified resins is essential for optimizing material design and enhancing product performance.

II. Factors Affecting the Dielectric Constant of Modified Resins

1. Molecular Structure: The molecular structure of modified resins directly influences their dielectric constant. For example, introducing polar groups or adjusting the length and regularity of molecular chains can effectively improve dielectric properties.
2. Type and Content of Fillers: Fillers such as carbon black or glass fibers can fill voids in the resin, reducing internal free volume and thereby increasing the dielectric constant. excessive fillers may increase internal stress, ultimately lowering the dielectric constant.
3. Crosslinking Density: The use of crosslinking agents increases the resin’s crosslinking density, improving mechanical strength and heat resistance while reducing the dielectric constant.
4. Temperature and Humidity: Environmental temperature and humidity affect the microstructure and intermolecular forces of the resin, subsequently altering its dielectric constant.
5. Processing Techniques: Factors like pressure and temperature during molding also impact the dielectric constant of modified resins.

III. Applications of the Dielectric Constant of Modified Resins

1. Electronic Packaging Materials: In electronic devices, modified resins serve as packaging materials. Their dielectric constant directly affects electrical isolation between chips and signal transmission speed. By adjusting molecular structures or adding specific fillers, the dielectric constant can be controlled to meet diverse application demands.
2. High-Performance Composites: In aerospace, automotive manufacturing, and other fields, composites with high strength and dielectric constants are required to reduce weight and enhance structural integrity. Through rational formulation and modification, these high-performance requirements can be achieved.
3. New Energy Fields: In solar panels, capacitors, and other new energy devices, modified resins act as insulating materials. The selection of their dielectric constant directly impacts device efficiency and safety. By optimizing material composition and processing conditions, high-performance modified resins can be developed.

The study and application of the dielectric constant of modified resins involve interdisciplinary collaboration across materials science, electronic engineering, and chemistry. By deeply understanding and rationally controlling key factors such as molecular structure, filler types, and processing techniques, the comprehensive performance of modified resins can be significantly improved to meet stringent industrial demands. In the future, advancements in new material technologies will further drive innovation and development in fields such as electronic information and energy storage through research on the dielectric constant of modified resins.