1、A critical review of dynamic bonds containing curing agents for epoxy
Investigated the mechanical, thermomechanical, thermal, and recycling properties of the epoxy thermosets cured by developed curing agents. Addressed the challenges, opportunities and emerging trends in the field.
2、Novel Thermal Latent Curing Agents for Epoxy Resins Based on Dual
Herein, we present a dual-locked thermal latent curing agent based on aminopyridines, protected by amidation and N -oxidation, designed to enhance both pot life and final curing efficiency.
3、Thermal curing of epoxy resins at lower temperature using 4
To expand the application fields of epoxy resins, there has been a growing demand for thermal latent curing agents that combine a lower curing temperature with a long storage lifetime for a one-component epoxy formulation.
4、Effect of Curing Agent Type on Curing Reaction Kinetics of Epoxy Resin
In this paper, low molecular weight polyamides, aromatic amines and anhydrides were selected as three kinds of curing agents and their isothermal viscosity-time properties were studied to...
Influence of different composite curing agents on the rapid curing
In particular, effective formulations are designed for mixing fast and slow curing agents, studying their effects on the curing behavior, curing quality, and mechanical properties of epoxy resins and elucidating their influence mechanisms.
Surface Chemistry and Molecular Dynamics of Epoxy Resin
In this study, we investigate the main reactions occurring on the surface of DEGBA/DEGBF epoxy resin following curing, post-curing, and thermal post-curing processes using Time-of-Flight Secondary Ion Mass Spectrometry (ToF-SIMS).
A phosphorus/silicon hybrid curing agent for epoxy resin
This study develop a phosphorus‑silicon hybrid curing agent (DA) with rational structural design that synergistically enhances the flame retardancy, thermal stability, and toughness of epoxy resins.
The epoxy resin system: function and role of curing agents
Curing agents are critical components of aqueous epoxy resin systems. Unfortunately, its uses and applications are restricted because of its low emulsifying yields. Epoxy resins are frequently used in electrical devices, castings, packaging, adhesive, corrosion resistance, and dip coating.
Current situation and development trend of reactive epoxy resin curing
Curing agent changes the properties of epoxy resin to obtain new curing products. With the development of industrial technology in China, there are many kinds of epoxy resin curing products, including polyamine curing agent, acid anhydride curing agent, polymercaptan curing agent and so on.
Optimizing Curing Profiles of One‐Component Epoxy Resins with Small
This study focused on the synthesis of small-molecule thermal latent curing agents (TLCs) containing reversible urea bonds and their utilization in one-component epoxy resins (OCERs).
Deferred Curing Agent Epoxy Resin
In today's industrial manufacturing sector, epoxy resins are highly favored due to their exceptional physical and chemical properties. They not only exhibit excellent adhesion, mechanical strength, and electrical insulation but also demonstrate superior chemical resistance and aging resistance. the curing process of epoxy resins often requires high temperatures, which limits their use in many applications. To address this challenge, scientists have developed a new material called deferred curing agents, aiming to resolve this issue by enabling epoxy resins to cure at lower temperatures, thereby broadening their application range.
Overview of Deferred Curing Agents
Deferred curing agents are substances used to regulate the curing speed of epoxy resins. They typically exist in liquid or powder form and can be added to epoxy resin formulations to achieve precise control over curing time. This additive significantly reduces the temperature required for curing, allowing epoxy resins to solidify at room temperature or even low temperatures, greatly enhancing their practicality.
Working Principle
Deferred curing agents adjust curing time by altering the movement rate of epoxy resin molecular chains. Specifically, when epoxy resin is mixed with a curing agent, the reactive functional groups in the curing agent react with the epoxy groups in the resin, forming a cross-linked structure. This process requires energy, and deferred curing agents provide this energy, accelerating the reaction and shortening the curing time.
Application Fields
Due to their ability to cure epoxy resins at lower temperatures, deferred curing agents have become highly valuable in applications traditionally requiring high-temperature curing. Examples include:
- Construction Industry: Epoxy resins can be used in construction at lower temperatures without increasing costs, particularly in winter or cold regions.
- Automotive Manufacturing: In the production of automotive parts, deferred curing agents reduce the need for curing ovens, improving efficiency.
- Electronics: Low-temperature curing epoxy resins enhance reliability and lifespan in electronic component encapsulation.
- Aerospace: In aerospace composite manufacturing, low-temperature curing epoxy resins reduce material weight while maintaining high strength.
Challenges and Prospects
Despite their benefits, deferred curing agents face challenges. First, their relatively high cost may limit large-scale adoption. Second, compatibility issues between different epoxy resin types/brands and deferred curing agents require further research. Additionally, specialized applications may demand new deferred curing agents to meet specific performance needs.
Looking ahead, advancements in technology promise greater roles for deferred curing agents in materials science and engineering. By optimizing performance and reducing costs, broader applications and societal value are within reach.
Deferred curing agents expand the usability of epoxy resins by enabling curing across wider temperature ranges. While challenges remain, ongoing technological progress ensures continued breakthroughs in this field, driving future innovation and development.
