1、DICYCLOPENTADIENE COMPOUND

Background Art [0002] Dicyclopentadiene-modified phenolic resins have a lower dielectric constant and lower hygroscopicity than other phenolic resins. Therefore, resins obtained by epoxidizing the dicyclopentadiene-modified phenolic resins are useful as raw materials of semiconductor sealing agents and printed circuit boards.

2、Phosphorus

Phosphorus-containing active esters modified dicyclopentadiene epoxy resins with simultaneously improved flame retardancy, thermal stability, and dielectric properties

3、Novel phosphorus‐containing dicyclopentadiene‐modified phenolic resins

DCPD-containing phenolic resin (DPR) was also synthesized by incorporating the DCPD-containing monomer HPTCDP with formaldehyde. DPR was further modified by grafting the phosphate group.

4、METHOD FOR PRODUCING DICYCLOPENTADIENE

In the method, the fluorine-based ion-exchange resin is washed with an organic solvent. The dicyclopentadiene-modified phenolic resin obtained by the method has a stable quality, has a high purity, and is inexpensive.

Method for producing dicyclopentadiene

A method for producing a dicyclopentadiene-modified phenolic resin. The method including reusing a fluorine-based ion-exchange resin as a catalyst in a reaction between a phenol and a dicyclopentadiene, the fluorine-based ion-exchange resin having been used as a catalyst when a phenol and a dicyclopentadiene are allowed to react with each other ...

Study on Preparation of Novel Dicyclopentadiene Phenol Epoxy Resin

This paper briefly describes the relevant properties of epoxy resin materials, and introduces the domestic and international progress of dicyclopentadiene (DCPD) phenolic epoxy resin.

Study on green synthesis of dicyclopentadiene phenol resin for electronics

At the same time, the structure of DPR resin was explored, and the contents of components with different degrees of polymerization in DPR resin, as well as the softening point and yield of DPR resin were determined.

Development and Applications of Functional Phenolic Resins

The developed cashew oil modified dicyclopentadi-ene type phenolic resin was synthesized by chemically bonding the aromatic rings of dicyclopentadiene type phenolic resin with the intramolecular double bonds of cashew oil by an electrophilic substitution reaction in

Novel phosphorus

DCPD-containing phenolic resin (DPR) was also synthesized by incorporating the DCPD-containing monomer HPTCDP with formaldehyde. DPR was further modified by grafting the phosphate group. The phosphorylation was confirmed by a Fourier transform infrared, 31 P-NMR spectroscopy, and an element analysis.

Study on Preparation of Novel Dicyclopentadiene Phenol Epoxy Resin

This paper briefly describes the relevant properties of epoxy resin materials, and introduces the domestic and international progress of dicyclopentadiene (DCPD) phenolic epoxy resin.

In the field of chemical materials, phenolic resin is highly favored for its excellent heat resistance, electrical insulation, and mechanical strength. traditional phenolic resins also have limitations, such as insufficient heat resistance and suboptimal mechanical properties. To address these issues, researchers have explored various methods to modify phenolic resins, among which dicyclopentadiene (DCP) modification has proven to be an effective approach. This paper provides a detailed introduction to the preparation process, performance characteristics, and application prospects of dicyclopentadiene-modified phenolic resin.

I. Preparation Process of Dicyclopentadiene-Modified Phenolic Resin

Dicyclopentadiene (DCP) is an important chemical raw material widely used in the rubber and coatings industries. During the modification of phenolic resin, DCP reacts with phenolic resin to form a copolymer with a more complex molecular structure, endowing the resin with new properties.

1. Raw Material Preparation: Phenolic resin (typically in powder form) and dicyclopentadiene (in liquid or gaseous form) are prepared according to specific ratios.

2. Mixing and Reaction: The two materials are thoroughly mixed and heated to a designated temperature for an extended period (ranging from hours to longer, depending on reaction conditions).

3. Post-Treatment: After cooling the product to room temperature, processes such as crushing and sieving are performed to obtain the final modified resin.

II. Performance Characteristics of Dicyclopentadiene-Modified Phenolic Resin

The modification significantly enhances the properties of phenolic resin:

1. Improved Heat Resistance: The modified resin exhibits higher thermal stability, maintaining its physical and chemical properties at elevated temperatures.

2. Enhanced Mechanical Performance: It demonstrates better toughness, impact resistance, hardness, and wear resistance, making it suitable for precision mechanical components.

3. Optimized Electrical Insulation: Under high-frequency electric fields, the modified resin shows superior insulation performance, reducing the risk of electrical failures.

III. Application Prospects of Dicyclopentadiene-Modified Phenolic Resin

With growing demand for high-performance materials, dicyclopentadiene-modified phenolic resin holds broad potential across multiple fields:

1. Electronics and Electrical Engineering: Its excellent electrical insulation and heat resistance make it ideal for insulating materials and encapsulation in electronic devices, ensuring stability in high-temperature environments.

2. Aerospace Industry: The resin’s high-temperature performance and fatigue resistance position it for use in critical components such as aircraft engines and rocket parts.

3. Automotive Manufacturing: Its lightweight and high-strength properties enable applications in automotive frames and chassis components, aligning with lightweighting trends.

4. Architecture and Decoration: The resin can be used to produce fire-resistant and soundproof materials like flooring, ceilings, and decorative panels, meeting modern safety and environmental standards.

As a high-performance material, dicyclopentadiene-modified phenolic resin offers vast application potential. By optimizing its preparation process, reducing costs, and improving quality, this resin can better meet market demands. Continuous exploration of new applications will further contribute to technological and industrial advancements.