1、Catalyst
These findings demonstrate that catalyst modification is an effective approach for optimizing the curing process and improving the mechanical, thermal, and electrical insulation properties of epoxy-based insulating materials.
2、Mechanical and Thermal Properties of Epoxy Resin upon Addition
Morphology, dynamic-mechanical, and thermal properties were characterized for modified epoxy resin/glass fiber composites.
3、Optimizing dielectric, mechanical, and thermal properties of epoxy
This study introduces three molecular modifications to epoxy resin systems using facile synthesis procedures, including modifiers with bulky groups and crosslinking potential to reduce the dielectric constant while enhancing mechanical and thermal reliability, along with deep traps to increase breakdown strength.
4、Synchronously Improving Mechanical and Thermal Performances of Cured
As an effort to improve toughness of epoxy resins without scarifying their heat resistance, four novel polyether sulphones (PESs) with epoxy groups (PES-Es) are developed as efficient toughness modifiers of epoxy resins.
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Abstract: In this paper, a novel polyimide with trifluoromethyl group (PIS) was synthesized successfully and used to improve the toughness of epoxy resins. Five modified epoxy resins (5, 7.5, 10, 12.5 and 15 wt%) were prepared and investigated, respectively.
Toughening epoxy resins: Recent advances in network architectures and
Thus, enhancing the toughness of epoxy resins while maintaining their high strength and thermal performance has become a long-standing challenge and research hotspot in polymer science and materials engineering.
Practical Technology of Toughening Epoxy Resin (II): Modification
During the epoxy curing process, strong intermolecular forces are generated between SEP and epoxy resin, which further enhances the heat resistance of modified epoxy resins. Better insulation of epoxy resin are achieved by adding engineering plastics with fine insulation equipment.
Enhancing the Mechanical and Thermal Properties of Epoxy Resin via
Efficient enhancement of the toughness of epoxy resins has been a bottleneck for expanding their suitability for advanced applications. Here, polysulfone (PSF) was adopted to toughen and modify the epoxy.
Research on Improving the Thermal Conductivity of Epoxy Resin with
Currently, the introduction of rigid groups into epoxy resins is the main method to improve their intrinsic thermal conductivity. The researchers explored the relationship between the flexible chains of epoxy monomers and the thermal conductivity of the modified epoxy resins (MEP).
Low viscosity and low temperature curing reactive POSS/epoxy hybrid
Results demonstrated that the OPEP system has excellent processability with low viscosity and long processing window period and satisfies the practical requirements of low-temperature curing.
In modern industry, the performance of materials directly impacts the quality and reliability of products. As a high-performance thermosetting resin, epoxy resin is widely used in electronics, automotive, aerospace, and other fields due to its excellent mechanical properties, electrical insulation, and chemical stability. epoxy resins often suffer from drawbacks such as high coefficients of thermal expansion and poor heat resistance, which limit their application range and performance in extreme environments. modifying the thermal flow properties of epoxy resins to enhance their thermal stability is a critical research direction in the field of material science.
Thermal flow modification refers to methods that improve thermal stability by altering the resin matrix structure or incorporating functional fillers. Such modifications not only reduce volumetric changes in epoxy resins at high temperatures but also enhance properties like creep resistance and fatigue resistance, thereby extending service life and improving product reliability and safety.
Various approaches exist for thermal flow modification of epoxy resins, with the most common being blending modification, filling modification, and crosslinking modification.
Blending modification involves mixing resin matrices with different thermal stabilities to achieve overall performance enhancement. For example, blending epoxy resin with thermally stable resins like polyimide or polyetheretherketone (PEEK) significantly improves thermal stability. Additionally, adjusting the ratio of the two resins allows precise control over the final product’s properties.
Filling modification introduces high-thermal-stability fillers (e.g., silicon carbide, boron nitride) into the epoxy matrix. These fillers maintain low coefficients of thermal expansion at elevated temperatures while providing robust mechanical properties, effectively suppressing volumetric changes in the epoxy under heat.
Crosslinking modification involves chemically forming crosslinked structures between epoxy molecular chains to boost thermal stability. Common crosslinking agents include phenolic resin and melamine. While this method increases thermal deformation temperatures and stability, it also raises material density and cost.
Beyond these primary methods, other techniques such as surface treatment and nanotechnology are applied to thermal flow modification. Surface treatments create protective films on epoxy surfaces to reduce thermal expansion, while nanotechnology incorporates nanoscale fillers to enhance thermal stability.
The effectiveness of thermal flow modification depends on multiple factors, including modification method selection, filler type and dosage, and resin preparation processes. Optimizing these parameters can significantly improve epoxy thermal stability, meeting demands in complex environments.
As a vital engineering plastic, epoxy resin’s thermal flow modification technology holds immense significance. Through continuous exploration and innovation, we can anticipate the development of superior and reliable epoxy materials, contributing further to advancements across industries.
