1、Novolac cured epoxy resin/fullerene modified clay composites: applied
In our continuous research regarding polymer/layered material composites, 5,19–23 we described novolac cured epoxy resin/modified clay composites which are applied in copper clad laminate.
2、Halogen Free, Low Loss Copper
Suitable conditions for the complete reaction between the phosphonate oligomer and epoxy resin are described and the resulting halogen-free laminates with improved properties such as low Df, low coefficient of thermal expansion (CTE), high peel strength, and good toughness are presented.
3、Journal of Applied Polymer Science
To develop low dielectric materials in high-frequency, high-speed copper-clad laminates (CCLs), furfuryl tertiary phenolic benzoxazine (FPBZ) was synthesized by Mannich condensation reaction using bio-based furfurylamine, p-tert-butylphenol, and paraformaldehyde.
Epoxy Resin Curing Agents for Copper Clad Laminates
MDI modified epoxy resin has higher heat resistance, toughness and adhesion with copper foil than ordinary epoxy resin, which can effectively solve the problem of "bursting" of copper clad laminate during processing.
Fabrication of phthalonitrile
Herein, phthalonitrile-based resin containing benzoxazine (BA-ph) were selected as polymer matrix, and various curing agents were introduced to investigate the polymerization of nitrile groups.
Copper
Copper cladding industry to adjust the main resin and curing agent to form a copper foil and reinforcing materials, the phenomenon of poor bonding, which requires copper foil to enhance the strength of the material and enhance the anti-stripping strength (PS).
Preparation and Properties Investigation of Polyphenylene
As electronic technology swiftly progresses, conventional epoxy resins can no longer fully meet the demands of copper‐clad laminates (CCLs).
New Phosphorus
Table 2 shows the formulations, their fire performance and some physical properties of copper clad laminates made with bisphenol A epoxy and cured with our material.
Synthesis and properties of cured epoxy mixed resin systems modified by
Redistributed polyphenylene oxide (rPPO) was synthesized and used to modify epoxy resin for use as high-frequency Copper Clad Laminates (CCLs).
Jiahua Chemical
Most of the copper clad laminate is epoxy resin system, which is matched with different curing agents to meet the requirements of heat resistance and mechanical properties.
In the field of electronic manufacturing, copper clad laminates (CCL) are widely used due to their excellent electrical properties, thermal stability, and mechanical strength. These materials are critical in applications such as printed circuit boards (PCBs), flexible printed circuits (FPCs), multilayer boards, and high-frequency circuits. A key step in achieving optimal performance for CCLs is epoxy curing, during which epoxy curing agents play a vital role.
Epoxy resin, a core component of these curing agents, reacts chemically with the copper foil on CCLs to form a hard, stable resin film. This process, known as curing, results in a composite structure with superior electrical insulation and mechanical strength.
The mechanism of epoxy curing agents involves chemical crosslinking reactions. When epoxy resin is mixed with a curing agent, a series of reactions occur, producing an insoluble and infusible three-dimensional network structure. This network enhances not only electrical performance but also mechanical strength and heat resistance.
Selecting the appropriate epoxy curing agent is crucial for CCL performance. Different curing agents offer varying characteristics, such as curing time, temperature range, and moisture resistance. For example, aromatic epoxy curing agents provide high thermal stability and low water absorption, suitable for high-temperature environments. In contrast, aliphatic epoxy curing agents exhibit better flexibility and processability, making them ideal for FPC production.
Advancements in technology have led to the development of new epoxy curing agents with lower volatile organic compound (VOC) emissions and improved eco-friendliness, aligning with modern environmental requirements. High-performance curing agents often incorporate additives like UV absorbers or antimicrobial agents to enhance specific functionalities.
cost considerations are significant. While premium curing agents deliver superior performance, they come at a higher price. Balancing performance and cost effectiveness remains a key research focus.
Beyond epoxy resin, auxiliary components like photoinitiators also impact CCL quality. These agents accelerate curing by initiating polymerization under UV or visible light, enabling precise control over curing speed and production efficiency.
The curing process itself—encompassing preheating, coating, and curing—requires meticulous parameter control. Excessive curing temperatures may cause over-crosslinking and degrade electrical properties, while insufficient curing can compromise mechanical strength. Environmental factors like temperature, humidity, and oxygen levels must also be strictly managed to ensure optimal results.
epoxy curing agents are indispensable for high-quality CCL manufacturing. By optimizing curing agent selection, refining process parameters, and addressing environmental variables, CCLs can achieve peak performance, reliability, and cost efficiency. As material science and manufacturing technologies advance, future CCLs are poised to become smarter, greener, and better suited to evolving market demands.
